Tetramethyl Dipropylenetriamine (TMBPA) for Low-Shrinkage Epoxy Composites in Electronics Packaging Abstract: This article provides a comprehensive overview of Tetramethyl Dipropylenetriamine (TMBPA), a crucial curing agent employed in the formulation of low-shrinkage epoxy composites for electronics packaging applications. We delve into its chemical properties, synthesis methods, curing mechanisms with epoxy resins, and the resulting advantages in...