2-ethylimidazole in epoxy encapsulants for semiconductor devices: a comprehensive review abstract: epoxy molding compounds (emcs) are indispensable materials in the packaging of semiconductor devices, providing physical protection, electrical insulation, and environmental barrier properties. 2-ethylimidazole (2-ei) is a widely utilized curing agent and accelerator in epoxy resin formulations for emcs. this review comprehensively examines the role...