2-Ethylimidazole in Epoxy Encapsulants for Semiconductor Devices: A Comprehensive Review Abstract: Epoxy molding compounds (EMCs) are indispensable materials in the packaging of semiconductor devices, providing physical protection, electrical insulation, and environmental barrier properties. 2-Ethylimidazole (2-EI) is a widely utilized curing agent and accelerator in epoxy resin formulations for EMCs. This review comprehensively examines the role...